Customized Device Support
The heat sink on the 262 can be customized to work with your device. Typically all that is needed is the data sheet for your device. Contact the factory for details and a price quote on customization.
- 0.25°C/W passive cooling efficiency
- Customizable heat sink
The 262 LaserMount was designed for high power devices not requiring full active temperature control, but still needing significant passive cooling to maintain the device temperature near ambient. With its large heat sink and integrated fan, the 262 can handle high thermal loads with a 0.25°C/W temperature rise.
Beyond the mount itself, the 264 works with our optional device cover:
The 260-C cover enhances the stability of the laser by minimizing the impact of ambient air currents.
|Laser Package Supported||
Various, contact factory
|Thermal resistance (°C/W)||
DB-9, male or 9W4, male
|Size (H x W x D) [in(mm)]||
3.0 (76.2) x 4.5 (114.3) x 6.0 (152.4)
¼-20 x 4